Item P19-1181

Wafer Tuck Point Blades

Easily removes grout and mortar from between bricks and concrete blocks in less than half the time of a conventional tuck blade. The unique design of Wafer Tuck Point Blades lets the users easily grind away damaged mortar by allowing the grinder to work at a higher speed than what can be achieved with a standard style tuck point blade. Available in two-blade and three-blade designs with 1/4" and 3/8” thicknesses, respectively.


Item Description Attributes
19-1181 Premium Double Wafer Tuck
Diameter: 4 1/2"
Double 1/4": 1/4"
19-1185 Premium Double Wafer Tuck
Diameter: 5"
Double 1/4": yes
19-1363 Premium Double Wafer Tuck
Diameter: 7"
Double 1/4": yes
19-1183 Premium Triple Wafer Tuck
Diameter: 4 1/2"
Triple 3/8": yes
19-1365 Premium Triple Wafer Tuck
Diameter: 5"
Triple 3/8": yes
19-1366 Premium Triple Wafer Tuck
Diameter: 7"
Triple 3/8": yes